Printed Circuit Board (PCB) Market Report: Trends, Forecast and Competitive Analysis

According to a new market report published by Lucintel, the future of the PCB market looks promising with opportunities in the computer/peripherals, communications, consumer electronics, industrial, automotive, and military/aerospace industries. The global PCB market is expected to reach an estimated $80.1 billion by 2023 with a CAGR of 3.3% from 2018 to 2023. The major growth drivers for this market are increasing demand for PCB in the communication industry, growth in connected devices and advancement in automotive electronics.

In this market, standard multilayer, flexible, HDI/microvia/build-up, IC substrate, rigid 1-2 sided, rigid flex, others are used for PCB manufacturing for substrate. Lucintel forecasts that standard multilayers will remain the largest substrate type due to increasing demand in computer and communication industries. The rigid-flex substrate is expected to witness the highest growth during the forecast period due to growing demand for smartphone and display applications.

Emerging trends, which have a direct impact on the dynamics of the PCB industry, include miniaturization of printed circuit boards, growing demand for high speed data and signal transmission, and development of green PCBs. Zhen Ding Technology Holding, NOK Corporation, TTM Technologies, Unimicron Technology, Compeq Manufacturing, Young Poong Electronics, Samsung Electro-Mechanics, Tripod Technology, Ibiden Co., and Daeduck GDS and others are among the major suppliers of PCB.

Lucintel, a leading global market research firm has analyzed growth opportunities in the global PCB market by end use industry, by product type, laminate type, raw material type, and region has compiled a comprehensive research report entitled “Growth Opportunities in the Global Printed Circuit Board (PCB) Market 2018-2023: Trends, Forecast, and Opportunity Analysis.” The Lucintel report serves as a catalyst for growth strategy by providing comprehensive data and analysis on trends, key drivers, and directions. The study includes a forecast for the global PCB market by end use industry, by product type, laminate type, raw material type, and region as follows:

By End Use Industry [$M shipment analysis for 2012 – 2023]:

  • Computer/Peripherals
  • Communications
  • Consumer Electronics
  • Industrial Electronics
  • Automotive
  • Military/Aerospace
  • Others

 

By Product Type [$M shipment analysis for 2012 – 2023]:

  • Standard Multilayer
  • Flexible Circuits
  • HDI/Microvia/Build-up
  • IC Substrate
  • Rigid 1-2 Sided
  • Rigid-flex
  • Others

 

By Laminate materials type [$M shipment analysis for 2012 – 2023]:

  • FR-4
  • FR-4 High Tg
  • FR-4 Halogen Free
  • Standard & Others
  • Flexible
  • Paper
  • Composite
  • Others

 

By Raw Material Usage [$M shipment analysis for 2012 – 2023]:

  • Glass Fabric
  • Epoxy Resin
  • Kraft Paper
  • Phenolic Resin
  • Polyimide Film

By Region [$M shipment analysis for 2012 – 2023]:

  • North America
  • Europe
  • APAC
  • ROW

This 205-page research report will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or click on this link https://www.lucintel.com/pcb-market.aspx#/  or   helpdesk@lucintel.com.

About Lucintel

Lucintel, the premier global management consulting and market research firm, creates winning strategies for growth. It offers market assessments, competitive analysis, opportunity analysis, growth consulting, M&A, and due diligence services to executives and key decision-makers in a variety of industries. For further information, visit www.lucintel.com.

This report answers following 11 key questions:

 

Q.1 What are some of the most promising, high-growth opportunities for the global PCB market by end use industry (Computer/Peripheral, Communication, Consumer Electronics, Industrial Electronics, Automotive, Military/Aerospace, Others), substrate (Standard Multilayer, Flexible, HDI/Microvia/Build-Up, IC Substrate, Rigid 1-2 Sided, Rigid Flex, Others), laminate type (FR-4, flexible, Paper, CEM and others), laminate raw material type (Glass Fabric, Epoxy Resin, Kraft Paper, Phenolic Resin, Polyimide Film), and region (North America, Europe, Asia Pacific, and the Rest of the World)?

  1. 2 Which segments will grow at a faster pace and why?

Q.3 Which regions will grow at a faster pace and why?

Q.4 What are the key factors affecting market dynamics? What are the drivers and challenges of the market?

Q.5 What are the business risks and threats to the market?

Q.6 What are the emerging trends in this market and reasons behind them?

Q.7 What are some changing demands of customers in the market?

Q.8 What are the new developments in the market? Which companies are leading these developments?

Q.9 Who are the major players in this market? What strategic initiatives are being implemented by key players for business growth?

Q.10 What are some of the competitive products and processes in this area and how big of a threat do they pose for loss of market share via product substitution?

Q.11 What M&A activity has occurred in the last 5 years?

 



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